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Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration.

Suraj PatilAsisa Kumar PanigrahiSatish BonamC. Hemanth KumarOm Krishan SinghShiv Govind Singh
Published in: 3DIC (2016)
Keyphrases
  • image structure
  • noise level
  • integrated circuit
  • real time
  • real world
  • genetic algorithm
  • data model
  • color images
  • noisy data
  • signal to noise ratio
  • improved algorithm
  • gaussian noise
  • noise model
  • noise immunity