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Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding.
Asisa Kumar Panigrahi
Satish Bonam
Tamal Ghosh
Siva Rama Krishna Vanjari
Shiv Govind Singh
Published in:
3DIC (2015)
Keyphrases
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long term
semiconductor manufacturing
integrated circuit
electron microscopy
short term
mechanical properties
massively parallel
high speed
x ray
high levels
multi layer
wafer fabrication
application layer
real time
multi agent
artificial intelligence
information retrieval