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Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration.
Asisa Kumar Panigrahi
Satish Bonam
Tamal Ghosh
Siva Rama Krishna Vanjari
Shiv Govind Singh
Published in:
3DIC (2016)
Keyphrases
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mechanical properties
low cost
high speed
electron microscopy
data sets
data compression
real time
compression algorithm
image compression
integrated circuit
high density
stainless steel
databases
information systems
vlsi circuits