Sarah Eunkyung Kim

Publication Activity (10 Years)

Years Active: 2010-2024
Publications (10 Years): 3

Top Topics

Electron Microscopy

Mechanical Properties

Top Venues

Microelectron. Reliab.

Publications

Sang Woo Park, Seul Ki Hong, Sarah Eunkyung Kim, Jong Kyung Park
First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer. IEEE Access 12 (2024)
Han Kyeol Seo, Hae-Sung Park, Sarah Eunkyung Kim
Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application. 3DIC (2019)
Hae-Sung Park, Han Kyeol Seo, Sarah Eunkyung Kim
Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding. 3DIC (2019)
Junsung Ma, Sungdong Kim, Sarah Eunkyung Kim
Characterization of flip chip bonded structure with Cu ABL power bumps. Microelectron. Reliab. 54 (8) (2014)
Sung-Geun Kang, Youngrae Kim, Eun-Sol Kim, Naeun Lim, Teakgyu Jeong, Jieun Lee, Sarah Eunkyung Kim, Sungdong Kim
Evaluation of wafer level Cu bonding for 3D integration. 3DIC (2011)
Seok Hwan Lee, Jaeyong Sung, Sarah Eunkyung Kim
Dynamic flow measurements of capillary underfill through a bump array in flip chip package. Microelectron. Reliab. 50 (12) (2010)
Youngrae Kim, Sung-Keun Kang, Sarah Eunkyung Kim
Study of thinned Si wafer warpage in 3D stacked wafers. Microelectron. Reliab. 50 (12) (2010)