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Study of thinned Si wafer warpage in 3D stacked wafers.

Youngrae KimSung-Keun KangSarah Eunkyung Kim
Published in: Microelectron. Reliab. (2010)
Keyphrases
  • integrated circuit
  • massively parallel
  • semiconductor manufacturing
  • databases
  • decision trees
  • multiscale
  • empirical studies
  • statistical analysis
  • theoretical framework
  • factors affecting