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Dynamic flow measurements of capillary underfill through a bump array in flip chip package.

Seok Hwan LeeJaeyong SungSarah Eunkyung Kim
Published in: Microelectron. Reliab. (2010)
Keyphrases
  • programmable logic
  • high speed
  • dynamic environments
  • dynamically changing
  • software package
  • case study
  • video camera
  • high density
  • measurement noise