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Evaluation of wafer level Cu bonding for 3D integration.

Sung-Geun KangYoungrae KimEun-Sol KimNaeun LimTeakgyu JeongJieun LeeSarah Eunkyung KimSungdong Kim
Published in: 3DIC (2011)
Keyphrases
  • evaluation method
  • databases
  • information integration
  • real time
  • data sets
  • decision trees
  • control system
  • empirical evaluation
  • finite element
  • evaluation criteria
  • integrated circuit