Richard Crisp

Publication Activity (10 Years)

Years Active: 1996-2019
Publications (10 Years): 2

Top Topics

Top Venues

Publications

Chun Shiah, C. N. Chang, Richard Crisp, C. P. Lin, C. N. Pan, C. P. Chuang, H. L. Chen, S. H. Jheng, T. F. Chang, W. J. Huang, K. C. Ting, Rick Dai, W. M. Huang, Bor-Doou Rong, Nicky Lu
A 4.8GB/s 256Mb(x16) Reduced-Pin-Count DRAM and Controller Architecture (RPCA) to Reduce Form-Factor & Cost for IOT/Wearable/TCON/Video/AI-Edge Systems. VLSI Circuits (2019)
Richard Crisp
Residual Bulk Image Characterization using Photon Transfer Techniques. IMSE (2017)
Richard Crisp, Bill Gervasi, Wael Zohni, Bel Haba
Cost-minimized double die DRAM packaging for ultra-high performance DDR3 and DDR4 multi-rank server DIMMs. ISQED (2012)
Richard Crisp
Residual bulk image quantification and management for a full frame charge coupled device image sensor. J. Electronic Imaging 20 (3) (2011)
Benedict Lau, Yiu-Fai Chan, Alfredo Moncayo, John Ho, Mike Allen, Joe Salmon, Jonathan Liu, Manish Muthal, Cliff Lee, Tim Nguyen, Bryce Horine, Mike Leddige, Kuojim Huang, Jason Wei, Leung Yu, Richard Tarver, Yuwen Hsia, Roxanne Vu, Ely Tsern, Haw-Jyh Liaw, Jim Hudson, David Nguyen, Kevin S. Donnelly, Richard Crisp
A 2.6-GByte/s multipurpose chip-to-chip interface. IEEE J. Solid State Circuits 33 (11) (1998)
Richard Crisp
Direct RAMbus technology: the new main memory standard. IEEE Micro 17 (6) (1997)
Richard Crisp
High Bandwidth RDRAM Technology Reduces System Cost. COMPCON (1996)