Peter J. Zampardi

Publication Activity (10 Years)

Years Active: 2004-2023
Publications (10 Years): 4

Top Topics

Stress Response

Simulation Tools

Integrated Circuit

Injection Lasers

Top Venues

Microelectron. Reliab.

Publications

Ciro Scognamillo, Antonio Pio Catalano, Vincenzo d'Alessandro, Peter J. Zampardi, Kerry Burger
Improving Performance of InGaP/GaAs HBT Arrays by means of Temperature-Dependent Base Ballasting Resistors. PRIME (2023)
Peter J. Zampardi
From Transistor Parameters to PA Circuit Performance (Invited). BCICTS (2021)
Charles S. Whitman, Michael G. Meeder, Peter J. Zampardi
Determination of safe reliability region over temperature and current density for through wafer vias. Microelectron. Reliab. 68 (2017)
Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. Microelectron. Reliab. 78 (2017)
Andre G. Metzger, Vincenzo d'Alessandro, Niccolò Rinaldi, Peter J. Zampardi
Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers. Microelectron. Reliab. 53 (9-11) (2013)
Peter J. Zampardi, Cristian Cismaru, Hal Banbrook, Bin Li
Measuring seam/crack formation in interconnect metallization. Microelectron. Reliab. 52 (12) (2012)
Nicolas G. Constantin, Kai H. Kwok, Hongxiao Shao, Cristian Cismaru, Peter J. Zampardi
Formulations and a Computer-Aided Test Method for the Estimation of IMD Levels in an Envelope Feedback RFIC Power Amplifier. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31 (12) (2012)
Peter J. Zampardi
Will CMOS amplifiers ever Kick-GaAs? CICC (2010)
Peter Katzin, Peter J. Zampardi
Introduction to the Special Issue on the Third IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS). IEEE J. Solid State Circuits 42 (10) (2007)
Andre G. Metzger, Ravi Ramanathan, Jiang Li, Hsiang-Chih Sun, Cristian Cismaru, Hongxiao Shao, Lance Rushing, Kenneth P. Weller, Ce-Jun Wei, Yu Zhu, Alexei Klimashov, Yevgeniy A. Tkachenko, Bin Li, Peter J. Zampardi
An InGaP/GaAs Merged HBT-FET (BiFET) Technology and Applications to the Design of Handset Power Amplifiers. IEEE J. Solid State Circuits 42 (10) (2007)
Francis M. Rotella, Cristian Cismaru, Yevgeniy Gene Tkachenko, Yuhua Cheng, Peter J. Zampardi
Characterization, design, modeling, and model validation of silicon-wafer M: N balun components under matched and unmatched conditions. IEEE J. Solid State Circuits 41 (5) (2006)
Keith Nellis, Peter J. Zampardi
A comparison of linear handset power amplifiers in different bipolar technologies. IEEE J. Solid State Circuits 39 (10) (2004)