Mostafa Said

Publication Activity (10 Years)

Years Active: 2013-2021
Publications (10 Years): 9

Top Topics

Design Methodology

Network On Chip

Top Venues

Future Gener. Comput. Syst.

Publications

Mostafa Said, Amin Sarihi, Ahmad Patooghy, Awny M. El-Mohandes, Abdel-Hameed A. Badawy, Fayez Gebali
Novel flexible buffering architectures for 3D-NoCs. Sustain. Comput. Informatics Syst. 29 (Part) (2021)
Amin Sarihi, Ahmad Patooghy, Ahmed Khalid, Mahdi Hasanzadeh, Mostafa Said, Abdel-Hameed A. Badawy
A Survey on the Security of Wired, Wireless, and 3D Network-on-Chips. IEEE Access 9 (2021)
Fulya Kaplan, Mostafa Said, Sherief Reda, Ayse K. Coskun
LoCool: Fighting Hot Spots Locally for Improving System Energy Efficiency. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (4) (2020)
Mostafa Said, Ahmed Shalaby, Fayez Gebali
Thermal-aware network-on-chips: Single- and cross-layered approaches. Future Gener. Comput. Syst. 91 (2019)
Mostafa Said, Sofiane Chetoui, Adel Belouchrani, Sherief Reda
Understanding the Sources of Power Consumption in Mobile SoCs. IGSC (2018)
Mostafa Said, Hossam Hassan, HyungWon Kim, Mostafa Khamis
A novel power reduction technique using wire multiplexing. SoCC (2017)
Mostafa Khamis, Mostafa Said, Ahmed Shalaby
Work-in-Progress: A Flexible Router Architecture for 3D NoCs. RTSS (2017)
Mostafa Said, Ahmed Shalaby, Farhad Mehdipour, Morteza Biglari-Abhari, Mohamed El-Sayed
A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias. Microprocess. Microsystems 43 (2016)
Hossam Hassan, Mostafa Said, HyungWon Kim
Performance evaluation of buffer sharing routers for Network on Chip. MWSCAS (2016)
Mostafa Said, Mohamed El-Sayed, Farhad Mehdipour, Nobuaki Miyakawa
Keep-Out-Zone analysis for three-dimensional ICs. VLSI-DAT (2014)
Mostafa Said, Farhad Mehdipour, Kazuaki J. Murakami, Mohamed El-Sayed
A Design Methodology for Performance Maintenance of 3D Network-on-Chip with Multiplexed Through-Silicon Vias. MES@ISCA (2014)
Mostafa Said, Farhad Mehdipour, Mohamed El-Sayed
Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias. DSD (2013)