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A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias.

Mostafa SaidAhmed ShalabyFarhad MehdipourMorteza Biglari-AbhariMohamed El-Sayed
Published in: Microprocess. Microsystems (2016)
Keyphrases
  • design methodology
  • high density
  • integrated circuit
  • network on chip
  • high speed
  • design process
  • data center
  • fuzzy neural network
  • power dissipation
  • databases
  • neural network
  • fuzzy logic
  • object oriented
  • input output