Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias.

Mostafa Said Farhad Mehdipour Mohamed El-Sayed

Published in: DSD (2013)

Keyphrases

high density
three dimensional
low density
integrated circuit
thin film
video streams
d objects
data center
image sequences
plasma etching
x ray
range images
depth map
noise reduction
multi view
software engineering
virtual reality
video data
similarity metrics
high speed