Huang-Kuang Kung

Publication Activity (10 Years)

Years Active: 2007-2017
Publications (10 Years): 1

Top Topics

Optimization Algorithm

Top Venues

Microelectron. Reliab.

Publications

Huang-Kuang Kung, Chi-Lung Hsieh
A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging. Microelectron. Reliab. 78 (2017)
Huang-Kuang Kung, Hung-Shyong Chen, Ming-Cheng Lu
The wire sag problem in wire bonding technology for semiconductor packaging. Microelectron. Reliab. 53 (2) (2013)
Huang-Kuang Kung
Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology. Microelectron. Reliab. 47 (7) (2007)