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Chi-Lung Hsieh
Publication Activity (10 Years)
Years Active: 2017-2017
Publications (10 Years): 1
Top Topics
Databases
Wire Bonding
Empirical Findings
Multiscale
Top Venues
Microelectron. Reliab.
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Publications
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Huang-Kuang Kung
,
Chi-Lung Hsieh
A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging.
Microelectron. Reliab.
78 (2017)