A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging.

Huang-Kuang Kung Chi-Lung Hsieh

Published in: Microelectron. Reliab. (2017)

Keyphrases

high speed
machine learning
empirical studies
genetic algorithm
decision trees
wire bonding
data sets
databases
neural network
multiscale
long term
study proposes
empirical findings