Hung-Shyong Chen

Publication Activity (10 Years)

Years Active: 2013-2013
Publications (10 Years): 0

Top Topics

Stress Response

Top Venues

Microelectron. Reliab.

Publications

Huang-Kuang Kung, Hung-Shyong Chen, Ming-Cheng Lu
The wire sag problem in wire bonding technology for semiconductor packaging. Microelectron. Reliab. 53 (2) (2013)