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Hankyul Kwon
Publication Activity (10 Years)
Years Active: 2022-2024
Publications (10 Years): 7
Top Topics
Mobile Platform
Deep Learning
Data Acquisition
Shared Memory Multiprocessors
Top Venues
COOL CHIPS
IEEE Micro
HCS
ISSCC
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Publications
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Junha Ryu
,
Hankyul Kwon
,
Wonhoon Park
,
Zhiyong Li
,
Beomseok Kwon
,
Donghyeon Han
,
Dongseok Im
,
Sangyeob Kim
,
Hyungnam Joo
,
Hoi-Jun Yoo
20.7 NeuGPU: A 18.5mJ/Iter Neural-Graphics Processing Unit for Instant-Modeling and Real-Time Rendering with Segmented-Hashing Architecture.
ISSCC
(2024)
Junha Ryu
,
Hankyul Kwon
,
Wonhoon Park
,
Zhiyong Li
,
Beomseok Kwon
,
Donghyeon Han
,
Dongseok Im
,
Sangyeob Kim
,
Hyungnam Joo
,
Minsung Kim
,
Hoi-Jun Yoo
A Low-Power Neural Graphics System for Instant 3D Modeling and Real-Time Rendering on Mobile AR/VR Devices.
COOL CHIPS
(2024)
Dongseok Im
,
Gwangtae Park
,
Junha Ryu
,
Zhiyong Li
,
Sanghoon Kang
,
Donghyeon Han
,
Jinsu Lee
,
Wonhoon Park
,
Hankyul Kwon
,
Hoi-Jun Yoo
DSPU: An Efficient Deep Learning-Based Dense RGB-D Data Acquisition With Sensor Fusion and 3-D Perception SoC.
IEEE J. Solid State Circuits
58 (1) (2023)
Hankyul Kwon
,
Gwangtae Park
,
Junha Ryu
,
Wooyoung Jo
,
Hoi-Jun Yoo
A 15.9 mW 96.5 fps Memory-Efficient 3D Reconstruction Processor with Dilation-based TSDF Fusion and Block-Projection Cache System.
ISCAS
(2023)
Dongseok Im
,
Gwangtae Park
,
Zhiyong Li
,
Junha Ryu
,
Sanghoon Kang
,
Donghyeon Han
,
Jinsu Lee
,
Wonhoon Park
,
Hankyul Kwon
,
Hoi-Jun Yoo
A Mobile 3-D Object Recognition Processor With Deep-Learning-Based Monocular Depth Estimation.
IEEE Micro
43 (3) (2023)
Dongseok Im
,
Gwangtae Park
,
Junha Ryu
,
Zhiyong Li
,
Sanghoon Kang
,
Donghyeon Han
,
Jinsu Lee
,
Wonhoon Park
,
Hankyul Kwon
,
Hoi-Jun Yoo
A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms.
COOL CHIPS
(2022)
Dongseok Im
,
Gwangtae Park
,
Zhiyong Li
,
Junha Ryu
,
Sanghoon Kang
,
Donghyeon Han
,
Jinsu Lee
,
Wonhoon Park
,
Hankyul Kwon
,
Hoi-Jun Yoo
DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip.
HCS
(2022)