Daniel F. Baldwin

Publication Activity (10 Years)

Years Active: 1989-2016
Publications (10 Years): 1

Top Topics

Printed Circuit Boards

Top Venues

Microelectron. Reliab.

Publications

Brett Fennell, Sangil Lee, Daniel F. Baldwin
Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid. Microelectron. Reliab. 65 (2016)
Hai Ding, I. Charles Ume, Jian Zhang, Daniel F. Baldwin
Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study. IEEE Trans. Instrum. Meas. 54 (5) (2005)
Daniel F. Baldwin, Thomas E. Abell, Man-Cheung Lui, Thomas L. De Fazio, Daniel E. Whitney
An integrated computer aid for generating and evaluating assembly sequences for mechanical products. IEEE Trans. Robotics Autom. 7 (1) (1991)
Thomas L. DeFazio, Daniel E. Whitney, Man-Cheung Lui, Thomas E. Abell, Daniel F. Baldwin
Aids for the design or choice of assembly sequences. SMC (1989)