Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study.
Hai DingI. Charles UmeJian ZhangDaniel F. BaldwinPublished in: IEEE Trans. Instrum. Meas. (2005)
Keyphrases
- hardware and software
- low cost
- case study
- computer systems
- high speed
- hardware software
- real world
- low power
- single chip
- control system
- computer vision
- machine learning
- software development
- ibm zenterprise
- database
- assembly process
- hardware software co design
- remote monitoring
- printed circuit boards
- information systems
- databases