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Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid.

Brett FennellSangil LeeDaniel F. Baldwin
Published in: Microelectron. Reliab. (2016)
Keyphrases
  • fluid model
  • real time
  • high speed
  • high density
  • printed circuit boards
  • low cost
  • degrees of freedom
  • boundary conditions
  • modeling method
  • stochastic model