Choong-Un Kim

Publication Activity (10 Years)

Years Active: 2020-2024
Publications (10 Years): 4

Top Topics

Mechanisms Underlying

Reliability Assessment

Top Venues

Publications

Hariram Mohanram, Harikrishnan Kumarasamy, Choong-Un Kim, Young-Joon Park, Srikanth Krishnan
Study of Thermomechanical Damage Mechanism in Al Interconnects in Al-SiO2 structure by High Density Peak Current. IRPS (2024)
Jorge Mendoza, Jimmy-Bao Le, Choong-Un Kim, Hung-Yun Lin
Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects. IRPS (2023)
Allison T. Osmanson, Mohsen Tajedini, Yi Ram Kim, Hossein Madanipour, Choong-Un Kim, Bradley Glasscock, Muhammad Khan
Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages. IRPS (2021)
Yi Ram Kim, Allison T. Osmanson, Hossein Madanipour, Choong-Un Kim, Patrick F. Thompson, Qiao Chen
Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects. IRPS (2020)