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Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.
Yi Ram Kim
Allison T. Osmanson
Hossein Madanipour
Choong-Un Kim
Patrick F. Thompson
Qiao Chen
Published in:
IRPS (2020)
Keyphrases
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failure rate
mechanisms underlying
neural network
input output
failure modes
database
real time
data sets
real world
computer vision
knowledge base
multi agent
configuration space
light scattering