Login / Signup

Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.

Yi Ram KimAllison T. OsmansonHossein MadanipourChoong-Un KimPatrick F. ThompsonQiao Chen
Published in: IRPS (2020)
Keyphrases
  • failure rate
  • mechanisms underlying
  • neural network
  • input output
  • failure modes
  • database
  • real time
  • data sets
  • real world
  • computer vision
  • knowledge base
  • multi agent
  • configuration space
  • light scattering