Boris Vaisband

Publication Activity (10 Years)

Years Active: 2014-2024
Publications (10 Years): 25

Top Topics

Thermal Infrared

Silicon Dioxide

Ultra Large Scale

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

ACM Great Lakes Symposium on VLSI

Publications

Yousef Safari, Yushu Zhao, Boris Vaisband
Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms. ACM Great Lakes Symposium on VLSI (2024)
Okyanus T. Gumus, Mousa Karimi, Boris Vaisband
Digital LIF Neuron for CTT-Based Neuromorphic Systems. ACM Great Lakes Symposium on VLSI (2023)
Samuel Dayo, Ataollah Saeed Monir, Mousa Karimi, Boris Vaisband
Statistical Weight Refresh System for CTT-Based Synaptic Arrays. ACM Great Lakes Symposium on VLSI (2023)
Yousef Safari, Pooya Aghanoury, Subramanian S. Iyer, Nader Sehatbakhsh, Boris Vaisband
Hybrid Obfuscation of Chiplet-Based Systems. DAC (2023)
Mousa Karimi, Ataollah Saeed Monir, Rezvan Mohammadrezaee, Boris Vaisband
CTT-Based Scalable Neuromorphic Architecture. IEEE J. Emerg. Sel. Topics Circuits Syst. 13 (1) (2023)
Dima Al Saleh, Yousef Safari, Fahad Rahman Amik, Boris Vaisband
P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs. SOCC (2023)
Yousef Safari, Boris Vaisband
A Robust Integrated Power Delivery Methodology for 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31 (3) (2023)
Yousef Safari, Boris Vaisband
Integrated Power Delivery Methodology for 3D ICs. ISQED (2022)
Yousef Safari, Anja Kroon, Boris Vaisband
Power Delivery for Ultra-Large-Scale Applications on Si-IF. CoRR (2022)
Yousef Safari, Anja Kroon, Boris Vaisband
Power Delivery for Ultra-Large-Scale Applications on Si-IF. ISCAS (2022)
Mousa Karimi, Mohamed Ali, Ahmad Hassan, Reza Bostani, Boris Vaisband, Mohamad Sawan, Benoit Gosselin
A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source. IEEE Access 10 (2022)
Yousef Safari, Boris Vaisband
Power Delivery for Silicon Interconnect Fabric. ISCAS (2021)
Boris Vaisband, Ange Maurice, Chong Wei Tan, Beng Kang Tay, Eby G. Friedman
Multi-Bit CNT TSV for 3-D ICs. ISCAS (2020)
Boris Vaisband, Subramanian S. Iyer
Global and semi-global communication on Si-IF. NOCS (2019)
Boris Vaisband, Subramanian S. Iyer
Communication Considerations for Silicon Interconnect Fabric. SLIP (2019)
Kannan K. Thankappan, Adeel Ahmad Bajwa, Boris Vaisband, SivaChandra Jangam, Subramanian S. Iyer
Reliability Evaluation of Silicon Interconnect Fabric Technology. IRPS (2019)
Subramanian S. Iyer, SivaChandra Jangam, Boris Vaisband
Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems. IBM J. Res. Dev. 63 (6) (2019)
Boris Vaisband, Eby G. Friedman
Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems. Future Gener. Comput. Syst. 87 (2018)
Boris Vaisband, Adeel Ahmad Bajwa, Subramanian S. Iyer
Network on interconnect fabric. ISQED (2018)
Boris Vaisband, Eby G. Friedman
Hexagonal TSV Bundle Topology for 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs (1) (2017)
Boris Vaisband, Eby G. Friedman
Hybrid energy harvesting in 3-D IC IoT devices. ISCAS (2017)
Boris Vaisband, Eby G. Friedman
Layer ordering to minimize TSVs in heterogeneous 3-D ICs. ISCAS (2016)
Boris Vaisband, Eby G. Friedman
Noise Coupling Models in Heterogeneous 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 24 (8) (2016)
Boris Vaisband, Eby G. Friedman
3-D floorplanning algorithm to minimize thermal interactions. ISCAS (2015)
Ioannis Savidis, Boris Vaisband, Eby G. Friedman
Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits. IEEE Trans. Very Large Scale Integr. Syst. 23 (10) (2015)
Boris Vaisband, Ioannis Savidis, Eby G. Friedman
Thermal conduction path analysis in 3-D ICs. ISCAS (2014)