Boon Ping Gan

Publication Activity (10 Years)

Years Active: 2007-2023
Publications (10 Years): 8

Top Topics

Reliability Assessment

Manufacturing Environment

Top Venues

Publications

Chew Wye Chan, Boon Ping Gan, Wentong Cai
Combining Time Series Data and Snapshot Data for Situation Aware Dispatching in Semiconductor Manufacturing. WSC (2023)
Alp Akcay, Stephan Biller, Boon Ping Gan, Christoph Laroque, Guodong Shao
Maintenance and Operations of Manufacturing Digital Twins. WSC (2023)
Jonas Friederich, Wentong Cai, Boon Ping Gan, Sanja Lazarova-Molnar
Equipment-centric Data-driven Reliability Assessment of Complex Manufacturing Systems. SIGSIM-PADS (2023)
Benedikt Schulz, Christoph Jacobi, Andrej Gisbrecht, Angelidis Evangelos, Chew Wye Chan, Boon Ping Gan
Graph Representation and Embedding for Semiconductor Manufacturing Fab States. WSC (2022)
Ching Foong Lee, Aik Ying Tang, Georg Seidel, Soo Leen Low, Boon Ping Gan
Operator Resource Planning in a Giga Fab During Covid-19 Restrictions. WSC (2021)
Chew Wye Chan, Boon Ping Gan, Wentong Cai
Towards Situation Aware Dispatching in a Dynamic and Complex Manufacturing Environment. WSC (2020)
Georg Seidel, Ching Foong Lee, Aik Ying Tang, Soo Leen Low, Boon Ping Gan, Wolfgang Scholl
Challenges Associated with Realization of Lot Level Fab Out Forecast in a Giga Wafer Fabrication Plant. WSC (2020)
Georg Seidel, Patrick Preuss, Cevahir Canbolat, Soo Leen Low, Chew Wye Chan, Boon Ping Gan, Ching Foong Lee, Prakash Manogaran, Aik Ying Tang
An Integration of Static and Dynamic Capacity Planning for a Ramping Fab. WSC (2019)
Peter Lendermann, Stephen John Turner, Malcolm Y. H. Low, Boon Ping Gan, Nirupam Julka, Lai Peng Chan, Wentong Cai, Loo Hay Lee, Ek Peng Chew, Suyan Teng, Leon F. McGinnis
An integrated and adaptive decision-support framework for high-tech manufacturing and service networks. J. Simulation 1 (2) (2007)