Chew Wye Chan

Publication Activity (10 Years)

Years Active: 2017-2023
Publications (10 Years): 8

Top Topics

Discrete Event Simulation

Situation Aware

Operations Management

Graph Representation

Top Venues

Publications

Chew Wye Chan, Boon Ping Gan, Wentong Cai
Combining Time Series Data and Snapshot Data for Situation Aware Dispatching in Semiconductor Manufacturing. WSC (2023)
Patrick Stöckermann, Alessandro Immordino, Thomas Altenmüller, Georg Seidel, Martin Gebser, Pierre Tassel, Chew Wye Chan, Feifei Zhang
Dispatching in Real Frontend Fabs With Industrial Grade Discrete-Event Simulations by Deep Reinforcement Learning with Evolution Strategies. WSC (2023)
Benedikt Schulz, Christoph Jacobi, Andrej Gisbrecht, Angelidis Evangelos, Chew Wye Chan, Boon Ping Gan
Graph Representation and Embedding for Semiconductor Manufacturing Fab States. WSC (2022)
Moon Gi Seok, Chew Wye Chan, Wentong Cai, Hessam S. Sarjoughian, Daejin Park
Runtime Abstraction-Level Conversion of Discrete-Event Wafer-fabrication Models for Simulation Acceleration. SIGSIM-PADS (2020)
Chew Wye Chan, Boon Ping Gan, Wentong Cai
Towards Situation Aware Dispatching in a Dynamic and Complex Manufacturing Environment. WSC (2020)
Georg Seidel, Patrick Preuss, Cevahir Canbolat, Soo Leen Low, Chew Wye Chan, Boon Ping Gan, Ching Foong Lee, Prakash Manogaran, Aik Ying Tang
An Integration of Static and Dynamic Capacity Planning for a Ramping Fab. WSC (2019)
Georg Seidel, Patrick Preuss, André Naumann, Soo Leen Low, Chew Wye Chan, Boon-Ping Gan
Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation. WSC (2018)
Georg Seidel, Ching Foong Lee, Ai Mei Kam, Boon-Ping Gan, Chew Wye Chan, André Naumann, Patrick Preuss
Harmonizing operations management of key stakeholders in wafer fab using discrete event simulation. WSC (2017)