Login / Signup

110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules.

Kenichi MiyaguchiYoojin BanNicolas PantanoXiao SunPhilippe AbsilLieve BogaertsPeter VerheyenDimitrios VelenisMarianna PantouvakiJoris Van Campenhout
Published in: ECOC (2021)
Keyphrases
  • high speed
  • liquid crystal
  • low cost
  • high density
  • gallium arsenide
  • data sets
  • three dimensional
  • silicon dioxide
  • charge coupled device