Development of high accuracy wafer thinning and pickup technology for thin wafer.
Kosuke KitaichiHaruo ShimamotoChuichi MiyazakiYoshiyuki AbeSigeaki SaitoShoji YasunagaPublished in: 3DIC (2011)
Keyphrases
- high accuracy
- rapid development
- semiconductor manufacturing
- case study
- integrated circuit
- st century
- software engineering
- technical issues
- preprocessing
- design tools
- current status
- design process
- information processing
- wafer fabrication
- future development
- information society
- data processing
- nsf funded
- information and communication technologies
- edge detection
- future trends
- manufacturing process
- digital technologies
- management information systems
- communication technologies
- knowledge based systems
- mobile technologies