Development of a distributed Bernoulli gripper for ultra-thin wafer handling.
Dong LiuWenyu LiangHaiyue ZhuChek Sing TeoKok Kiong TanPublished in: AIM (2017)
Keyphrases
- cooperative
- distributed systems
- lightweight
- development environment
- development process
- mixture model
- software engineering
- knowledge management
- communication cost
- computing environments
- semiconductor manufacturing
- data sets
- integrated circuit
- distributed computing
- rapid development
- real valued
- distributed environment
- control system
- information technology
- multi agent systems