Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits.

Shih-Hsu Huang Hua-Hsin Yeh

Published in: IEICE Trans. Fundam. Electron. Commun. Comput. Sci. (2014)

Keyphrases

integrated circuit
three dimensional
multi layer
electron beam
x ray
image sequences
virtual reality
application layer
upper layer
d objects
computed tomography
heat flow
data sets
laser beam
electric field
printed circuit boards
surface model
range images
image analysis
neural network