Stacked solder bumping technology for improved solder joint reliability.
Xingsheng LiuShuangyan XuGuo-Quan LuDavid A. DillardPublished in: Microelectron. Reliab. (2001)
Keyphrases
- failure rate
- mechanical properties
- printed circuit boards
- high temperature
- case study
- rapid development
- cost effective
- computer systems
- semiconductor devices
- information systems
- data processing
- real time
- expert systems
- personal computer
- database systems
- improved algorithm
- decision trees
- reliability analysis
- genetic algorithm
- machine learning
- real world