Guo-Quan Lu

Publication Activity (10 Years)

Years Active: 2001-2023
Publications (10 Years): 4

Top Topics

Power Electronics

Dc Dc Converter

Injection Lasers

Top Venues

Microelectron. Reliab.

IEEE Trans. Ind. Electron.

Publications

Shengchang Lu, Tianyu Zhao, Zichen Zhang, Khai D. T. Ngo, Rolando Burgos, Guo-Quan Lu
Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors. IEEE Trans. Ind. Electron. 70 (1) (2023)
Shan Gao, Khai D. T. Ngo, Guo-Quan Lu
Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement. IEEE Trans. Ind. Electron. 68 (5) (2021)
Ting Ge, Yi Yan, Guo-Quan Lu, Khai D. T. Ngo
Over-Molded Inductor (OMI) - Feasibility Demonstration in a DC-DC Converter. IEEE Trans. Ind. Electron. 64 (7) (2017)
David Berry, Adrian Townsend, Weikun He, Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu
Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection. Microelectron. Reliab. 63 (2016)
Su-Yan Zhao, Xin Li, Yun-Hui Mei, Guo-Quan Lu
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate. Microelectron. Reliab. 55 (12) (2015)
Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu
Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules. Microelectron. Reliab. 55 (12) (2015)
Haidong Yan, Yun-Hui Mei, Xin Li, Pu Zhang, Guo-Quan Lu
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions. Microelectron. Reliab. 55 (12) (2015)
Gang Chen, Ze-Sheng Zhang, Yun-Hui Mei, Xin Li, Guo-Quan Lu, Xu Chen
Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging. Microelectron. Reliab. 53 (4) (2013)
Xin Li, Gang Chen, Xu Chen, Guo-Quan Lu, Lei Wang, Yun-Hui Mei
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. Microelectron. Reliab. 53 (1) (2013)
Y. C. Lin, X. Chen, Xingsheng Liu, Guo-Quan Lu
Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. Microelectron. Reliab. 45 (1) (2005)
Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
Effect of substrate flexibility on solder joint reliability. Microelectron. Reliab. 42 (12) (2002)
Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dushan Boroyevich, Guo-Quan Lu
Design issues of a three-dimensional packaging scheme for power modules. Microelectron. Reliab. 41 (2) (2001)
Shatil Haque, Guo-Quan Lu
Effects of device passivation materials on solderable metallization of IGBTs. Microelectron. Reliab. 41 (5) (2001)
Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
Stacked solder bumping technology for improved solder joint reliability. Microelectron. Reliab. 41 (12) (2001)