David A. Dillard

Publication Activity (10 Years)

Years Active: 2001-2002
Publications (10 Years): 0

Publications

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
Effect of substrate flexibility on solder joint reliability. Microelectron. Reliab. 42 (12) (2002)
Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard
Stacked solder bumping technology for improved solder joint reliability. Microelectron. Reliab. 41 (12) (2001)