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Design issues of a three-dimensional packaging scheme for power modules.
Shatil Haque
Kalyan Siddabattula
Mike Craven
Sihua Wen
Xingsheng Liu
Dushan Boroyevich
Guo-Quan Lu
Published in:
Microelectron. Reliab. (2001)
Keyphrases
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design issues
three dimensional
design decisions
usability issues
image sequences
building blocks
artificial intelligence
high speed
x ray
design process
databases
knowledge base
trade off
human body
range images
hardware software partitioning