On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction.
Adit D. SinghC. Mani KrishnaPublished in: ITC (1991)
Keyphrases
- product quality
- process control
- manufacturing process
- quality control
- manufacturing processes
- semiconductor manufacturing
- software product
- quality improvement
- software quality
- quality assurance
- machine vision
- software process
- product design
- product development
- test cases
- cooperative
- integrated circuit
- artificial intelligence
- project management
- relational databases
- image processing