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Fabrication of Ultra Thick, Ultra High Aspect Ratio Microcomponents by Deep and Ultra Deep X-Ray Lithography.

Linke JianBernd LoechelHeinz-Ulrich ScheunemannMartin BednarzikYohannes M. DestaJost Goettert
Published in: ICMENS (2003)
Keyphrases
  • x ray
  • electron beam
  • electron beam lithography
  • ultra high
  • high speed
  • aspect ratio
  • x ray images
  • digital x ray images
  • intraoperative
  • three dimensional
  • integrated circuit
  • perspective projection
  • medical images