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Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits.

Ioannis SavidisSyed M. AlamAnkur JainScott PozderRobert E. JonesRitwik Chatterjee
Published in: Microelectron. J. (2010)
Keyphrases
  • real time
  • integrated circuit
  • printed circuit boards
  • low cost
  • high speed
  • electron beam
  • electrical properties
  • metal oxide semiconductor
  • high density
  • modeling method
  • physical characteristics