Wire bonding on glass substrates via vapour deposition of Ag-Ti film.

Nicholas Kam Michael David Hook Tanya Tang Michael Mayer

Published in: Microelectron. J. (2019)

Keyphrases

film thickness
wire bonding
thin film
electron microscopy
stress response
electrical properties
room temperature
refractive index
bond pad
plasma etching
lagrange interpolation
permalloy films
multi layer
chemical vapor deposition
digital signal processor
integrated circuit
neural network