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Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs).
Qianwen Chen
Cui Huang
Zheyao Wang
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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high density
aspect ratio
integrated circuit
thin film
perspective projection
si sio
plasma etching
computer vision
viewpoint
data center
semiconductor devices