Zheyao Wang

Publication Activity (10 Years)

Years Active: 2006-2024
Publications (10 Years): 9

Top Topics

Silicon Nitride

Top Venues

Microelectron. Reliab.

Publications

Xiaopei Zhu, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu
Hiding from thermal imaging pedestrian detectors in the physical world. Neurocomputing 564 (2024)
Xiaopei Zhu, Zhanhao Hu, Siyuan Huang, Jianmin Li, Xiaolin Hu, Zheyao Wang
Hiding from infrared detectors in real world with adversarial clothes. Appl. Intell. 53 (23) (2023)
Xiaopei Zhu, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu
Fooling thermal infrared pedestrian detectors in real world using small bulbs. CoRR (2021)
Xiaopei Zhu, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu
Fooling Thermal Infrared Pedestrian Detectors in Real World Using Small Bulbs. AAAI (2021)
Ya Mou, Zhanqing Yu, Kaitian Huang, Qing Ma, Rong Zeng, Zheyao Wang
Research on a Novel MEMS Sensor for Spatial DC Electric Field Measurements in an Ion Flows Field. Sensors 18 (6) (2018)
Hao Xiong, Zheyao Wang
Fabrication of Chalcogenide Microlens Array Using Hot Embossing Method. IEEE SENSORS (2018)
Kun Zhou, Zhida Zhao, Zheyao Wang
Fabrication of silicon nanowire pH sensors using high output, low cost sidewall mask technology. IEEE SENSORS (2017)
Xingjun Xue, Shujie Yang, Dong Wu, Liyang Pan, Zheyao Wang
Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive. IEEE SENSORS (2016)
Fan Bu, Qing Ma, Zheyao Wang
Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride. Microelectron. Reliab. 65 (2016)
Cui Huang, Dong Wu, Liyang Pan, Zheyao Wang
Air-gap/SiO2 liner TSVs with improved electrical performance. 3DIC (2015)
Qianwen Chen, Wuyang Yu, Cui Huang, Zhimin Tan, Zheyao Wang
Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners. Microelectron. Reliab. 53 (5) (2013)
Mengyun Yue, Dong Wu, Zheyao Wang
A 15-bit two-step sigma-delta ADC with embedded compression for image sensor array. ISCAS (2013)
Qianwen Chen, Cui Huang, Zheyao Wang
Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs). Microelectron. Reliab. 52 (11) (2012)
Zheyao Wang, Jianshe Liu, Litian Liu
ferroelectric thin films on multilayered silicon substrates. IEEE Trans. Instrum. Meas. 55 (1) (2006)