Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive.

Xingjun Xue Shujie Yang Dong Wu Liyang Pan Zheyao Wang

Published in: IEEE SENSORS (2016)

Keyphrases

high speed
high density
infrared
integrated circuit
low density
markov networks
plasma etching
low power
np complete
data center
field effect transistors
semiconductor devices
thin film
magnetic recording
chemical vapor deposition
frame rate
np hard
high bandwidth
image processing
real time