Challenges and developments of copper wire bonding technology.
Peisheng LiuLiangyu TongJinlan WangLei ShiHao TangPublished in: Microelectron. Reliab. (2012)
Keyphrases
- wire bonding
- paradigm shift
- cost effective
- lessons learned
- key issues
- technological advances
- key technologies
- technical challenges
- case study
- rapid development
- data processing
- real world
- future development
- advanced technologies
- thin film
- technical solutions
- enabling technologies
- stress response
- bond pad
- current status
- open issues
- technical issues
- challenges facing
- technical aspects