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Liangyu Tong
Publication Activity (10 Years)
Years Active: 2012-2012
Publications (10 Years): 0
Top Topics
Advanced Technologies
Open Issues
Technical Issues
Bond Pad
Top Venues
Microelectron. Reliab.
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Publications
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Peisheng Liu
,
Liangyu Tong
,
Jinlan Wang
,
Lei Shi
,
Hao Tang
Challenges and developments of copper wire bonding technology.
Microelectron. Reliab.
52 (6) (2012)