Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via.
Kazuki WatanabeYoshiharu KariyaNaoyuki YajimaKizuku ObinataYoshiyuki HiroshimaShunichi KikuchiAkiko MatsuiHiroshi ShimizuPublished in: Microelectron. Reliab. (2018)