A novel method to mitigate TSV electromigration for 3D ICs.
Yuanqing ChengAida Todri-SanialAlberto BosioLuigi DillioPatrick GirardArnaud VirazelPascal VivetMarc BellevillePublished in: ISVLSI (2013)
Keyphrases
- high accuracy
- cost function
- error rate
- detection method
- high precision
- preprocessing
- significant improvement
- computational complexity
- segmentation method
- objective function
- main contribution
- support vector machine svm
- optimization method
- statistical model
- energy function
- experimental study
- least squares
- machine learning
- experimental evaluation
- dynamic programming
- prior knowledge
- pairwise
- image segmentation