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Transient Leakage Current as a Non-destructive Probe of Wire-bond Electrochemical Failures.

Md. Asaduz Zaman MamunAmar MavinkurveMichiel van SoestbergenMuhammad Ashraful Alam
Published in: IRPS (2023)
Keyphrases
  • leakage current
  • bond pad
  • wire bonding
  • steady state
  • stress response
  • low voltage
  • silicon dioxide
  • root cause
  • mass transfer
  • power line
  • electrical properties
  • real time
  • high speed
  • hardware and software