Large-Margin Extreme Learning Machines With Hybrid Features for Wafer Map Defect Recognition.
Zhengkun YiWanfeng ShangDong WangMeng YinChunjie ChenWei FengXinyu WuPublished in: IEEE Trans. Instrum. Meas. (2024)
Keyphrases
- feature extraction
- recognition rate
- extreme learning machines
- feature vectors
- feature set
- extracting features
- recognition algorithm
- recognition accuracy
- low level
- feature space
- pattern recognition
- image features
- co occurrence
- visual object recognition
- robust recognition
- semiconductor manufacturing
- discrimination power
- automatic recognition
- action recognition
- maximum a posteriori
- training data
- computer vision
- face images
- support vector