Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs.
Kuan-Te WuJin-Fu LiYun-Chao YuChih-Sheng HouChi-Chun YangDing-Ming KwaiYung-Fa ChouChih-Yen LoPublished in: ATS (2014)
Keyphrases
- fault tolerance
- fault tolerant
- distributed computing
- load balancing
- distributed systems
- field effect transistors
- response time
- high availability
- peer to peer
- database replication
- replicated databases
- low cost
- multi channel
- group communication
- mobile agents
- fault management
- component failures
- data replication
- high density
- artificial intelligence
- data sets