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Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate.

Cheng ChenFengze HouFengman LiuQian SheLiqiang CaoLixi Wan
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • reliability analysis
  • radio frequency
  • rf sputtering
  • high density
  • condition monitoring
  • relevance feedback