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Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate.
Cheng Chen
Fengze Hou
Fengman Liu
Qian She
Liqiang Cao
Lixi Wan
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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reliability analysis
radio frequency
rf sputtering
high density
condition monitoring
relevance feedback