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Fengze Hou
Publication Activity (10 Years)
Years Active: 2016-2017
Publications (10 Years): 3
Top Topics
Infrared
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Reliability Analysis
Top Venues
Microelectron. Reliab.
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Publications
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Cheng Chen
,
Fengze Hou
,
Fengman Liu
,
Qian She
,
Liqiang Cao
,
Lixi Wan
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate.
Microelectron. Reliab.
79 (2017)
Delong Qiu
,
Liqiang Cao
,
Qidong Wang
,
Fengze Hou
,
Xugang Wang
Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling.
Microelectron. Reliab.
74 (2017)
Peng Wu
,
Fengze Hou
,
Cheng Chen
,
Jun Li
,
Fengman Liu
,
Jing Zhang
,
Liqiang Cao
,
Lixi Wan
Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.
Microelectron. Reliab.
65 (2016)