Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology.
Xiao HuoGuo-Wei XiaoKevin J. ChenPhilip C. H. ChanPublished in: CICC (2003)
Keyphrases
- high speed
- semiconductor devices
- printed circuit boards
- cmos technology
- thin film
- solar cell
- low cost
- metal oxide semiconductor
- high density
- silicon on insulator
- cost effective
- case study
- visual inspection
- electron beam
- frequency band
- integrated circuit
- mechanical properties
- steady state
- ibm power processor
- gallium arsenide
- gate insulator